L3Harris Technologies has been granted a patent for an electronic assembly with a chassis, electronic modules, and sealing retainers. The design allows for efficient cooling with aligned gas passageways and features on glide surfaces to maintain proper spacing during insertion. GlobalData’s report on L3Harris Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on L3Harris Technologies, AR/VR head-up displays was a key innovation area identified from patents. L3Harris Technologies's grant share as of February 2024 was 73%. Grant share is based on the ratio of number of grants to total number of patents.

Electronic assembly with cooling gas passageways and sealing retainer

Source: United States Patent and Trademark Office (USPTO). Credit: L3Harris Technologies Inc

A recently granted patent (Publication Number: US11930613B2) discloses an electronic assembly designed to enhance cooling efficiency and secure electronic modules within a chassis. The assembly includes a chassis with multiple electronic module mounting positions, each equipped with cooling gas passageways. Electronic modules, featuring glide surfaces and cooling gas pathways, are securely positioned in the chassis using sealing retainers. These retainers, with cooling gas passageways aligned with the chassis and module pathways, prevent direct contact between the modules and sealing gaskets. The design ensures proper spacing through cooperating features on the glide surfaces, maintaining the modules securely in place while facilitating easy insertion and removal.

Furthermore, the patent details a method for mounting electronic modules within the chassis, emphasizing the use of sealing retainers with aligned cooling gas passageways and glide surfaces. By incorporating protrusions and valleys on the glide surfaces, the method ensures precise alignment and spacing between the modules and sealing gaskets during insertion and seating. The tapered distal end of the module glide surface further enhances the secure positioning of the electronic modules within the chassis. Overall, the innovative design of the electronic assembly aims to optimize cooling efficiency, facilitate easy installation, and ensure the stable placement of electronic modules within the chassis for improved performance and reliability.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.