The Micro Systems Technologies (MST) Group provides advanced solutions for microelectronics manufacturing, including high-performance / high-reliability printed circuit boards (PCBs), liquid crystal polymers (LCP) and ceramic substrates, as well as advanced assembly technologies.
Microelectronics solutions for the aerospace industry
Based on its comprehensive knowledge and experience in challenging industries such as active implants, MST delivers services that meet the demanding performance and reliability requirements of the aerospace electronics sector.
MST provides highly reliable solutions with miniaturisation capabilities and 100% traceability.
Modules for medical and aircraft electronics
Micro Systems Engineering (MSE), which is another affiliate of the MST Group, was founded in 1984 as a supplier of electronic modules for active medical implants, and is now an important partner and specialist for the international electronics industry.
The company is located in Berg, Germany, and offers complex low-temperature co-fired ceramic (LTCC) substrates along with advanced assembly and semiconductor packaging processes.
The company applies its expertise to every sector where high reliability, miniaturisation, intense temperatures, high frequencies or hermetic encapsulation play a crucial role.
Featuring LTCC technology and a comprehensive process portfolio, MSE supports many applications in the aerospace, microwave and radio frequency (RF) industry. MSE is ISO 9001 and ISO 13485 certified.
LTCC for HF low-loss, sensor packages and multi-chip modules
MSE manufactures LTCC, which offers excellent RF and microwave performance characteristics.
Its low sintering temperature of approximately 900°C allows co-firing with highly conductive metals such as silver and gold.
The first-rate mechanical and electrical properties of LTCC substrates, combined with the ability to embed passive components, offer superior RF performance and device miniaturisation for HF applications.
Comprehensive advanced assembly technologies
The MSE site in Germany offers a complete range of advanced assembly solutions for demanding customer requirements.
Surface mount technology (SMT) and chip and wire technologies are available for the assembly of SMD, ball grid array (BGA), land grid array (LGA), chip scale packages (CSP), flip chip or bare die components on ceramic and organic substrates.
Various die attach technologies such as gluing by epoxy printing/dispensing, pre-forms, and stamping are provided, as well as soldering by solder printing, dispensing and pre-forms.
High-precision die bonders can pick from wafers, waffle or gel packs.
Wire bonding comprises ultrasonic binding for Al thin wires, thermosonic wedge bonding for Au thin and Au cold wires, as well as thermosonic ball/wedge bonding for Au thin wires.
Die protection/encapsulation solutions comprise of glop top (temperature or UV curing), underfill, junction coating, transfer molding and soldering, or gluing for covers and lids.