The US Army has contracted Leidos to support the Army Geospatial Center’s (ACG) High-Resolution Three Dimensional, (HR3D) Geospatial Information Operation and Technology Integration programme.
The period of performance for the single-award contract, which is estimated to be worth up to $600m, includes a one-year base period. It also has three additional one-year options.
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Leidos will primarily perform the contractual work at its Virginia facility and various Continental United States (CONUS) and Outside the Continental United States (OCONUS) locations.
The contract will see Leidos continue to support AGC’s BuckEye programme, which provides mission-critical unclassified high-resolution colour imagery and digital 3D terrain across all relevant operational areas worldwide.
The company will also continue to supply contractor-owned and contractor-operated aircraft and a professional cadre to support HR3D data collection, storage, processing and dissemination.
According to the company, the BuckEye geospatial information is an invaluable tool to meet military and civilian requirements such as strengthening partnerships and partner capacity, besides humanitarian assistance and disaster relief.
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By GlobalDataLeidos Defense Group president Gerry Fasano said: “We are excited to support the AGC’s critical mission of providing timely, accurate and relevant geospatial data to the warfighter.
“Throughout the geospatial community, we continue to innovate on behalf of our customers.
“Leidos looks forward to leveraging our technical, engineering and software expertise to enable our warfighters to maintain a decisive advantage on the battlefield.”
Insufficient and unclassified HR3D geospatial data also restricts the US Army’s ability to engage other countries in expanding their capabilities.
Leidos stated that the HR3D programme will address this gap for high-resolution mapping products.
In May, Leidos secured a position on a multiple-award task order contract supporting intelligence missions from the US Defense Intelligence Agency (DIA).
