Endicott to Develop Electronic Packaging for US Military

14 December 2009 (Last Updated December 14th, 2009 18:30)

The US Department of Defence has awarded a $105m contract to Endicott Interconnect (EI) for the research, development and manufacturing of electronic packaging technologies for the military. As part of the contract, $66.1m has been awarded to manufacture card frame assemblies for a high-r

The US Department of Defence has awarded a $105m contract to Endicott Interconnect (EI) for the research, development and manufacturing of electronic packaging technologies for the military.

As part of the contract, $66.1m has been awarded to manufacture card frame assemblies for a high-reliability, high-performance computing application and to supply spares in support of programme sustainment.

In addition, EI will provide sustainment work on all modules, assemblies and substrates for the life of the product.

The task order is a modification to the previously awarded contract, under which EI produced semiconductor packaging, multichip module assemblies, printed circuit boards, functionally-tested circuit board assemblies.

The company has also won a $39.5m contract for second phase development of electronic packaging technologies, including printed circuit boards and organic substrates for a next-generation super computer application.

The contract is a modification to the existing contract under which EI supports the exploration and development of advanced, high-speed electronic packaging technologies.