Mercury Systems has received a $3.2m follow-on order from an undisclosed defence prime contractor for the delivery of its BuiltSecure ruggedised memory devices.

The current order was booked in the second quarter of Mercury Systems’ fiscal year 2018 with the BuiltSecure devices expected to be delivered over the next several quarters. They will be integrated into an advanced airborne military computing system.

Mercury Systems Microelectronics Secure Solutions Group vice-president and general manager Iain Mackie said: “Receiving this BuiltSecure memory order from a prominent defence prime contractor reaffirms Mercury’s leadership role in the design and manufacturing of commercial microelectronics in a highly secure and trusted environment.

“We are honoured to provide long-term supply continuity of high-speed, SWaP-optimised memory devices enabling the success of our military forces in the harshest operating environments.”

“The BuiltSecure high-density secure memory devices benefit from the company’s three-dimensional packaging technology.”

The BuiltSecure high-density secure memory devices benefit from the company’s three-dimensional packaging technology. They are able to transform a two-dimensional array of memory devices into a single, vertically-integrated memory module that is ruggedised for the most adverse military operating environments.

The devices provide up to 85% space savings. They are designed and produced in Mercury Systems’s Advanced Microelectronics Center (AMC) in Phoenix, Arizona, US.

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In January, the company received a $7.7m follow-on order from a defence prime contractor for the BuiltSecure devices to be integrated into the advanced airborne command, control, and intelligence system.

Alongside BuiltSecure, the company’s digital microelectronics products include secure military-grade solid-state drives, selective availability anti-spoofing module (SAASM) devices, and precision-engineered system-in-package (SiP) devices.