BAE Systems had 13 patents in 3D printing during Q2 2024. The patent filed by BAE Systems Plc in Q2 2024 is for a clip designed to retain a chip tray and lid. The clip includes side walls, a rear wall, an upper peripheral edge, and a lower peripheral edge. The chip tray has pockets for holding semiconductor devices, while the lid features a shock absorbing layer and an electrostatic dissipative layer integrated into its interior. GlobalData’s report on BAE Systems gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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BAE Systems had no grants in 3D printing as a theme in Q2 2024.

Recent Patents

Application: Clip and lid system for a chip tray (Patent ID: US20240170315A1)

The patent filed by BAE Systems Plc describes a clip designed to retain a chip tray and lid for transporting and handling semiconductor devices. The clip includes side walls, a rear wall, upper and lower peripheral edges defining open areas, and a front opening for receiving the chip tray and lid. The lid features a shock-absorbing layer and an electrostatic dissipative layer integrated into its interior, providing protection for the semiconductor devices.

Additionally, the system described in the patent includes a chip tray with pockets for holding semiconductor devices, a lid with shock-absorbing and electrostatic dissipative layers, and the clip for retaining the chip tray and lid. The clip is designed with features such as protruding posts, recessed portions, and open regions for viewing labels on the lid or chip tray. It provides a friction fit and compression on the lid and chip tray, ensuring secure transportation and handling of the semiconductor components.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.