Sumitomo Precision Products has been granted a patent for a substrate processing method involving forming dummy patterns, arranging a stencil mask, and separating the patterns to obtain a submount. The method aims to improve the precision and efficiency of metal film formation on substrates. GlobalData’s report on Sumitomo Precision Products gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Sumitomo Precision Products, was a key innovation area identified from patents. Sumitomo Precision Products's grant share as of February 2024 was 28%. Grant share is based on the ratio of number of grants to total number of patents.

Substrate processing method with dummy patterns and stencil mask

Source: United States Patent and Trademark Office (USPTO). Credit: Sumitomo Precision Products Co Ltd

A recently granted patent (Publication Number: US11895779B2) discloses a substrate processing method involving several key steps. The method includes preparing a substrate with upper and lower surfaces, forming dummy patterns and grooves on the substrate, arranging a stencil mask with multiple opening patterns, coating the substrate through the openings, and separating the dummy pattern to divide the substrate into pieces. Notably, the grooves penetrate the substrate in a specific direction, ensuring the exposed surface of the body portion is correctly positioned. The method also involves the precise formation of coated regions on the side and upper surfaces of the body portion, separated by intervals to achieve desired outcomes.

Furthermore, the patent details additional steps and configurations to enhance the substrate processing method. These include the stencil mask covering specific areas, the connection of the dummy pattern to the substrate only on one end, and the formation of grooves to facilitate the coating process. The method also involves the formation of an insulating layer on the end surface of the body portion, further refining the substrate processing technique. Overall, the patent outlines a comprehensive approach to substrate processing, incorporating intricate steps and configurations to achieve precise and efficient results in dividing and coating substrates for various applications.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.