Raytheon Technologies has been granted a patent for a manufacturing method involving forming apertures in a plate and bonding a sheet to create a grid structure. The method aims to optimize the vertical thickness of the components. GlobalData’s report on Raytheon Technologies gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Raytheon Technologies, Photovoltaic drones was a key innovation area identified from patents. Raytheon Technologies's grant share as of February 2024 was 64%. Grant share is based on the ratio of number of grants to total number of patents.

Manufacturing method for forming grid structures with metal sheets

Source: United States Patent and Trademark Office (USPTO). Credit: Raytheon Technologies Corp

A recently granted patent (Publication Number: US11925971B2) discloses a manufacturing method that involves forming a grid structure by creating apertures in a plate and bonding a sheet to it. The method includes the use of fittings, such as bases and flanges, which are bonded to either the plate or the sheet during the assembly process. The bonding process involves brazing the sheet to the plate, and machining is used to create the apertures in the plate. Additionally, stiffening ribs are integrated into the grid structure to enhance its structural integrity.

Furthermore, the patent describes the formation of multiple grid structures by repeating the process with a second plate and sheet. The second grid structure is bonded concurrently with the first one, and fittings are also attached during this bonding process. The method allows for the creation of grid structures with polygonal cross-sectional geometries and orthogrid structures. The materials used in the manufacturing process, such as nickel-based alloys, contribute to the durability and performance of the grid structures. The angular offset between the first and second grid structures adds versatility to their applications.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.