Hypertac has announced the introduction of a technologically advanced EMI filtering and transient protection facility at its London manufacturing site.
Focused on saving weight, space and cost, the new facility enables customers from a wide range of markets to protect their equipment, both internal and external, against EMI/RFI and transient energy spikes by combining filtering components and electronic protection devices within its connectors and interface solutions.
Hypertac’s ability to include EMI filters and transient protection devices within the actual connector obviates the need for extra components and PCB assemblies. This saves on BOMs, design and manufacturing time whilst enhancing reliability and performance due to reduced wiring and lower component count.
The ESD protected filter assembly clean room offers a complete range of capabilities and processes, embracing PCB assembly and build; soldering (PCB, contact, cable, components); complex cable assembly; conformal coating; sub assembly and connector build; ATE and manual testing; potting and curing; component screening; and burn in capabilities.
The new facility, together with Hypertac’s EMI filter knowledge, enables the business to specify and recommend optimum filter styles (e.g. C, LC and Pi) and values (up to 1microFarad) on receipt of signal type and data rate. It can provide insertion loss simulations/prediction that account for actual source and load impedances and verify insertion loss performance across an entire frequency range.
Transient protection in accordance with RTCA D160F waveform and level specifications can be provided.
Connector types that can incorporate filtering include military circular (38999, 5015, 26500); rectangular (JN1123, Arinc 600, Arinc 404, 83527); D style (D-Sub 24308, Micro-D 83513); and feed through filter modules.
The ability to incorporate filtering and transient components within connectors requires a detailed understanding of ceramic and metal interaction. Hypertac’s design approach uses compliant connection technology for interface between contacts and ceramic and between ceramic and shell, resulting in a robust construction that meets both the application need as well as the customers’ assembly processes (e.g. soldering).
Where required for use in demanding and high reliability applications, full verification and quality testing covers vibration; mechanical shock; sealing against water and particle ingress; DWV at sea level and altitude; insulation resistance; salt spray; earth bond resistance testing/shell to shell conductivity; durability; thermal shock and cycling; temperature life; cyclic humidity; current de-rating; and transient protection testing.
Bill Henderson, technical director at Hypertac said, “The filtering and transient facility is a great asset to Hypertac, giving us an edge over competitors and the ability to offer customers cutting edge technology that saves them space, weight and cost. Having the facility to incorporate filtering and transient suppression within the connector helps us to be even more responsive and reduce time to market for our customers, adding value and giving them a competitive advantage in their marketplace.”